Nippon Rika MCPCB Official Site

MCPCB

Introducing about Nippon Rika Group's MCPCB.

 

We are able to respond to customers' request such as choice of material and development of MCPCB.

Power Module

  • Main circuit, drive circuit, power circuit and control circuit can be printed on one composite metal base. Hence, the connection of the circuits is not necessary.
  • Since bare chip can be connected directly to MCPCB, the size of product is capable to be miniaturized.
  • MCPCB contains both an aluminum layer and highly thermal conductive dielectric layer, which have an ability to dissipate heat. As a result, they are highly reliable and extremely effective to prevent device from a rise in temperature.
  • Our products can meet to customers' desirable specification and design.

Two layers of metal base composite MCPCB

  • Power part and control part can be designed on one plate.
  • Insulating layer consists of our high heat release MCPCB material.

High heat release・Large Current MCPCB

MCPCB is used instead of DBC base.